With reliable temperature control and quick connection, the new generation of CPET MCU aging test line is here

Against the backdrop of continuous technological iteration in the power electronics industry, new‑energy and automotive electronics sectors have generally adopted a mass‑production pattern featuring multiple product categories, small‑batch sizes and rapid changeovers. Conventional fixed burn‑in production lines suffer from rigid structures, high retrofitting difficulty and steep upgrade costs. They struggle to adapt to frequently changing test conditions, often resulting in low equipment utilization, insufficient production‑line compatibility and extended return‑on‑investment cycles. These production bottlenecks hinder enterprises’ mass‑production efficiency and market responsiveness.

As a national‑level Specialized, Refined, Differential and Innovative ("Little Giant") enterprise and national high‑tech enterprise, CPET (Zhongkeyuan) has delved into intelligent power‑electronic testing for over a decade. Drawing on profound technical expertise, the company has developed a high‑temperature burn‑in technical solution for automotive MCUs: the MCU is supplied with high‑voltage DC power by charging piles, while a three‑phase inductor load applies load to the MCU under a reactive‑power operating mode.

Design Key Points:

1.The overall system architecture adopts a simplified 1‑to‑4 MCU configuration. Each cabinet has two upper‑and‑lower slots with independent control; water channels of the upper and lower slots are connected in series.

2.Every two vertically adjacent slots form one chamber with independent temperature control. Each single chamber delivers 5 kW heat dissipation capacity. For burn‑in operations, temperature shall be adjustable and stably maintained within 35‑85 °C. Key thermal performance requirements: heating from ambient temperature to 85 °C ≤ 20 min; temperature stabilization at 85 °C ≤ 30 min; cooling from 85 °C down to 50 °C ≤ 20 min. Temperature accuracy: ±5 °C; no‑load temperature uniformity: less than 5 °C. Surface temperature of the cabinet shall not exceed 43 °C.

3.The monitoring sub‑rack is replaced with distributed service single‑boards with Ethernet communication.

4.Electrical connectors and anti‑overflow water quick couplings share one backplane (MC long‑lead‑time components).

5.Three‑phase inductor: 0.1 mH, 250 A, peak 450 A, air‑cooled type.

6.Heat‑dissipation openings are arranged across fan shrouds; fan noise shall be controlled.

7.User‑friendly and aesthetic door handles are adopted; door air‑leakage issues are addressed.

8.Interfaces: each unit is equipped with one water outlet and one water inlet with quick‑connect function; inner pipe diameter ≥ 16 mm.

Modular‑Unit & Distributed Architecture:

Overall equipment dimension: Length 1250 mm × 6 + 650 mm = 8200 mm, Depth 1600 mm, Height 1950 mm (fans excluded). Height of product placement position: approx. 400 mm. The product zone adopts a two‑layer layout, holding one product per layer. A total of 12 products can be placed in 2 layers × 6 columns. Electrical control units are arranged in the load zone, and three‑phase inductors are installed at the bottom of burn‑in cabinets.

Temperature‑Control Principle:

1.Cold air enters from one side of the burn‑in cabinet while hot air exhausts from the opposite side. When the internal cabinet temperature is lower than the set burn‑in temperature, heaters on both sides work at full power for rapid temperature rise. Once temperature exceeds the upper limit, duct heaters stop operation, and exhaust fans activate for heat dissipation. Air is cooled by the air cabinet before circulating back into the burn‑in cabinet, keeping internal temperature within target range.

2.Constant‑temperature mode: when temperature falls between lower and upper set limits, heaters stop output, and circulating fans drive hot‑air circulation. Constant‑temperature regulation is realized via the air cabinet.

3.Three‑level over‑temperature protection for heating zone:

• • PLC software‑based over‑temperature protection
  • EGO over‑temperature protection for heating zone
  • Mechanical temperature‑switch over‑temperature protection for heating zone

Vehicle docking

1.Quick docking is realized between input‑output electrical connection tooling trays and burn‑in cabinets.

2.Fast‑plug terminals plus copper bars enable rapid connection between products and trays.

3.Water channels support quick docking between water trays and burn‑in cabinets, with pull‑out self‑sealing design. Special water nozzles realize fast connection between trays and products.

4.Wiring is only required once for product initial test, burn‑in and final test, saving labor and reducing wear on product connectors.

5.The rapid docking method for vehicles is aging.

6.Achieve rapid connection between the vehicle and the aging cabinet

Note: The high-voltage power supply input lines and communication lines between the tooling and the products are manually plugged in. The three-phase output lines of the load adopt the OT terminal lock fixture high-current terminal method. Customers can choose the quick crimping method between the self-made tooling and the product. The tooling tray and the aging cabinet can be quickly interlocked.